Specifications at a Glance
Processor & Memory
The module is built around an ARM Cortex-M4 running at 120 MHz with a hardware floating-point unit (FPU). This gives you enough compute headroom for real-time signal processing, lightweight cryptography, and running the ANX OS Firmware alongside your application code simultaneously.512 KB Internal Flash
Stores the ANX OS Firmware image and your application code. The firmware occupies approximately 200 KB, leaving over 300 KB for your application.
128 KB RAM
Shared between the firmware runtime and your application heap and stack. The firmware reserves approximately 32 KB, leaving ~96 KB for application use.
4 MB External SPI Flash
Used for over-the-air firmware update staging, filesystem storage, and application asset storage. Accessible via the ANX SDK filesystem API.
Hardware FPU
The Cortex-M4 FPU accelerates single-precision floating-point operations, which is useful for sensor fusion algorithms and signal filtering.
Connectivity
The ANX dev module includes three independent connectivity interfaces. All wireless functionality is managed by the ANX OS Firmware, which exposes a unified connection API through the ANX SDK.Wi-Fi — 802.11 b/g/n, 2.4 GHz
Wi-Fi — 802.11 b/g/n, 2.4 GHz
The onboard Wi-Fi radio supports 802.11 b/g/n at 2.4 GHz with WPA2/WPA3 personal security. The firmware handles the full TCP/IP stack, DHCP, DNS, and TLS, and exposes HTTP, MQTT, and raw socket APIs to your application code. Maximum throughput is approximately 20 Mbps in ideal conditions.The integrated PCB antenna is optimised for operation without a ground plane clearance zone. If you’re embedding the module in a metal enclosure, route an external antenna via the U.FL connector on the underside of the board.
Bluetooth 5.0 BLE
Bluetooth 5.0 BLE
The Bluetooth 5.0 BLE radio supports both peripheral and central roles simultaneously. Use it to implement custom GATT services, iBeacon/Eddystone advertisement, or BLE-based provisioning workflows. The ANX SDK includes a high-level BLE API as well as direct access to the HCI layer for advanced use cases.BLE and Wi-Fi share a single 2.4 GHz antenna with automatic coexistence management handled by the firmware. You do not need to manage radio scheduling manually.
USB 2.0 Full Speed
USB 2.0 Full Speed
The USB-C port operates at USB 2.0 Full Speed (12 Mbps) and is used for both power delivery and the CDC-ACM serial interface that the ANX CLI communicates over. The firmware also supports USB Mass Storage and USB HID device classes, which you can enable through the SDK configuration API.
I/O Interfaces
All 20 GPIO pins operate at 3.3 V logic. Do not apply 5 V signals directly to GPIO pins — use a level shifter if you need to interface with 5 V peripherals.- Digital I/O
- Serial Buses
- ADC & PWM
The module exposes 20 GPIO pins via the 2× 20-pin headers. Each pin is individually configurable as input, output, open-drain, or alternate function. Internal pull-up and pull-down resistors are available on all pins and configurable via the SDK.
Power
The ANX dev module is designed to operate across a wide range of power sources and to support battery-powered deployments with aggressive sleep current targets.
The module includes an onboard LiPo charger IC that charges from the USB-C input at up to 500 mA. When USB power is not present, the module automatically switches to the LiPo battery. In deep sleep mode — with the main processor halted and all peripherals powered down — the module draws less than 10 µA, enabling years of operation from a small battery in duty-cycled sensor applications.
Physical & Mechanical
The ANX dev module is designed to fit into tight enclosures while also being easy to breadboard during development.
The castellated edges along both long sides of the board allow you to reflow-solder the module directly onto a carrier PCB as a component, eliminating the need for connectors in your final design. The 2× 20-pin through-hole headers are compatible with standard 2.54 mm breadboards and development carrier boards.
Operating Conditions
The module is not rated for outdoor or harsh-environment use without additional conformal coating or enclosure protection. Sustained operation at the temperature or humidity extremes will reduce long-term reliability of the onboard flash memory.
The GPIO pinout, alternate function mappings, and castellated edge pad assignments are documented in full on the Pinout Reference page. Refer to that page before designing a custom carrier board.