> ## Documentation Index
> Fetch the complete documentation index at: https://launchpad.anxlabs.com/llms.txt
> Use this file to discover all available pages before exploring further.

# ANX Dev Module Hardware Specifications

> Technical specifications for the ANX dev module: processor, memory, connectivity, power requirements, and supported operating environments.

The ANX dev module is the hardware foundation of the ANX Labs platform. It packages an ARM Cortex-M4 microcontroller, onboard Wi-Fi and Bluetooth, USB connectivity, and a complete power management circuit onto a compact 58 mm × 25 mm board with castellated edges — giving you a single component that takes you from early-stage prototyping all the way to a production-ready SMD design. Every electrical and mechanical detail on this page reflects the hardware you receive in the box.

## Specifications at a Glance

| Category           | Specification                                 |
| ------------------ | --------------------------------------------- |
| Processor          | ARM Cortex-M4 @ 120 MHz                       |
| Flash (internal)   | 512 KB                                        |
| RAM                | 128 KB                                        |
| Flash (external)   | 4 MB SPI                                      |
| Wi-Fi              | 802.11 b/g/n, 2.4 GHz                         |
| Bluetooth          | Bluetooth 5.0 BLE                             |
| USB                | USB 2.0 Full Speed                            |
| GPIO               | 20 pins (3.3 V logic)                         |
| UART               | 2×                                            |
| I2C                | 2×                                            |
| SPI                | 1×                                            |
| ADC                | 8-channel, 12-bit                             |
| PWM                | 4-channel                                     |
| Supply voltage     | 5 V via USB-C                                 |
| I/O logic level    | 3.3 V                                         |
| Battery            | 3.7 V LiPo with onboard charging              |
| Deep sleep current | \< 10 µA                                      |
| Dimensions         | 58 mm × 25 mm                                 |
| Headers            | 2× 20-pin at 2.54 mm pitch, castellated edges |
| Temperature range  | −20 °C to +70 °C                              |
| Humidity           | 10–90% RH, non-condensing                     |

***

## Processor & Memory

The module is built around an **ARM Cortex-M4 running at 120 MHz** with a hardware floating-point unit (FPU). This gives you enough compute headroom for real-time signal processing, lightweight cryptography, and running the ANX OS Firmware alongside your application code simultaneously.

<CardGroup cols={2}>
  <Card title="512 KB Internal Flash" icon="database">
    Stores the ANX OS Firmware image and your application code. The firmware occupies approximately 200 KB, leaving over 300 KB for your application.
  </Card>

  <Card title="128 KB RAM" icon="memory">
    Shared between the firmware runtime and your application heap and stack. The firmware reserves approximately 32 KB, leaving \~96 KB for application use.
  </Card>

  <Card title="4 MB External SPI Flash" icon="hard-drive">
    Used for over-the-air firmware update staging, filesystem storage, and application asset storage. Accessible via the ANX SDK filesystem API.
  </Card>

  <Card title="Hardware FPU" icon="calculator">
    The Cortex-M4 FPU accelerates single-precision floating-point operations, which is useful for sensor fusion algorithms and signal filtering.
  </Card>
</CardGroup>

***

## Connectivity

The ANX dev module includes three independent connectivity interfaces. All wireless functionality is managed by the ANX OS Firmware, which exposes a unified connection API through the ANX SDK.

<Accordion title="Wi-Fi — 802.11 b/g/n, 2.4 GHz">
  The onboard Wi-Fi radio supports 802.11 b/g/n at 2.4 GHz with WPA2/WPA3 personal security. The firmware handles the full TCP/IP stack, DHCP, DNS, and TLS, and exposes HTTP, MQTT, and raw socket APIs to your application code. Maximum throughput is approximately 20 Mbps in ideal conditions.

  The integrated PCB antenna is optimised for operation without a ground plane clearance zone. If you're embedding the module in a metal enclosure, route an external antenna via the U.FL connector on the underside of the board.
</Accordion>

<Accordion title="Bluetooth 5.0 BLE">
  The Bluetooth 5.0 BLE radio supports both peripheral and central roles simultaneously. Use it to implement custom GATT services, iBeacon/Eddystone advertisement, or BLE-based provisioning workflows. The ANX SDK includes a high-level BLE API as well as direct access to the HCI layer for advanced use cases.

  BLE and Wi-Fi share a single 2.4 GHz antenna with automatic coexistence management handled by the firmware. You do not need to manage radio scheduling manually.
</Accordion>

<Accordion title="USB 2.0 Full Speed">
  The USB-C port operates at USB 2.0 Full Speed (12 Mbps) and is used for both power delivery and the CDC-ACM serial interface that the ANX CLI communicates over. The firmware also supports USB Mass Storage and USB HID device classes, which you can enable through the SDK configuration API.
</Accordion>

***

## I/O Interfaces

All 20 GPIO pins operate at 3.3 V logic. Do not apply 5 V signals directly to GPIO pins — use a level shifter if you need to interface with 5 V peripherals.

<Tabs>
  <Tab title="Digital I/O">
    The module exposes **20 GPIO pins** via the 2× 20-pin headers. Each pin is individually configurable as input, output, open-drain, or alternate function. Internal pull-up and pull-down resistors are available on all pins and configurable via the SDK.

    | Feature             | Detail                        |
    | ------------------- | ----------------------------- |
    | Total GPIO          | 20 pins                       |
    | Logic level         | 3.3 V                         |
    | Max source/sink     | 8 mA per pin, 50 mA total     |
    | Pull-up / pull-down | Configurable, \~40 kΩ typical |
    | Interrupt support   | Rising, falling, both edges   |
  </Tab>

  <Tab title="Serial Buses">
    Two UART, two I2C, and one SPI interface are available as alternate functions on the GPIO pins. Each interface can be mapped to multiple pin combinations via the pinmux configuration in the SDK.

    | Interface | Count | Max Speed         |
    | --------- | ----- | ----------------- |
    | UART      | 2×    | Up to 4 Mbps      |
    | I2C       | 2×    | 100/400/1000 kbps |
    | SPI       | 1×    | Up to 50 MHz      |
  </Tab>

  <Tab title="ADC & PWM">
    The **8-channel 12-bit ADC** provides a full-scale input range of 0–3.3 V with a resolution of approximately 0.8 mV per count. All eight channels can be sampled in sequence using the DMA-backed continuous conversion mode available in the ANX SDK.

    Four **PWM channels** are available with independent frequency and duty cycle control. PWM frequency is configurable from 1 Hz up to 1 MHz, making them suitable for LED dimming, motor control, and audio tone generation.

    | Interface | Count     | Resolution / Range            |
    | --------- | --------- | ----------------------------- |
    | ADC       | 8-channel | 12-bit, 0–3.3 V input         |
    | PWM       | 4-channel | 1 Hz–1 MHz, 0–100% duty cycle |
  </Tab>
</Tabs>

***

## Power

The ANX dev module is designed to operate across a wide range of power sources and to support battery-powered deployments with aggressive sleep current targets.

| Power Parameter          | Value                         |
| ------------------------ | ----------------------------- |
| Primary supply           | 5 V via USB-C                 |
| I/O logic level          | 3.3 V (onboard LDO regulated) |
| Battery input            | 3.7 V single-cell LiPo        |
| Battery charging         | Onboard, up to 500 mA CC/CV   |
| Active current (typical) | \~80 mA with Wi-Fi active     |
| Deep sleep current       | \< 10 µA                      |

The module includes an onboard LiPo charger IC that charges from the USB-C input at up to 500 mA. When USB power is not present, the module automatically switches to the LiPo battery. In deep sleep mode — with the main processor halted and all peripherals powered down — the module draws less than 10 µA, enabling years of operation from a small battery in duty-cycled sensor applications.

<Warning>
  The onboard LiPo charger is rated for single-cell 3.7 V lithium polymer batteries only. Do not connect multi-cell battery packs or batteries with a nominal voltage other than 3.7 V — doing so will damage the charging circuit and may create a fire hazard.
</Warning>

***

## Physical & Mechanical

The ANX dev module is designed to fit into tight enclosures while also being easy to breadboard during development.

| Dimension      | Value                             |
| -------------- | --------------------------------- |
| PCB size       | 58 mm × 25 mm                     |
| PCB thickness  | 1.6 mm                            |
| Headers        | 2× 20-pin, 2.54 mm pitch          |
| Edge mounting  | Castellated edges (1.27 mm pitch) |
| Mounting holes | 4× M2, one at each corner         |
| Weight         | \~6 g (without battery)           |

The castellated edges along both long sides of the board allow you to reflow-solder the module directly onto a carrier PCB as a component, eliminating the need for connectors in your final design. The 2× 20-pin through-hole headers are compatible with standard 2.54 mm breadboards and development carrier boards.

***

## Operating Conditions

| Parameter             | Minimum | Maximum     |
| --------------------- | ------- | ----------- |
| Operating temperature | −20 °C  | +70 °C      |
| Storage temperature   | −40 °C  | +85 °C      |
| Relative humidity     | 10% RH  | 90% RH      |
| Condensing humidity   | —       | Not allowed |

The module is not rated for outdoor or harsh-environment use without additional conformal coating or enclosure protection. Sustained operation at the temperature or humidity extremes will reduce long-term reliability of the onboard flash memory.

<Note>
  The GPIO pinout, alternate function mappings, and castellated edge pad assignments are documented in full on the [Pinout Reference](/dev-module/pinout) page. Refer to that page before designing a custom carrier board.
</Note>